プロジェクトの背景
Against the backdrop of expanding 5G and IoT communication infrastructure, a leading telecom equipment manufacturer launched a 2026 customization project for compact communication device power box enclosures. These enclosures protect internal power supply modules, circuit boards, and wiring components, requiring reliable performance in long-term operation and consistent quality across small-batch production.
主な要件は次のとおりです。
- Ultra-compact design (dimensions: 8.8×4.2×2.5cm, weight ≤0.03kg)
- Dimensional tolerance ≤±0.03mm for precise interface alignment
- Secure wall-mounting capability for flexible installation
- Precise cutouts for power input/output and signal interfaces
- Durable matte black finish for professional appearance
- Stable batch production quality for 470 units
Sanjun Hardware was selected for our proven precision manufacturing capabilities, mature electrostatic powder coating process, and track record of delivering high-consistency custom enclosures for compact electronic equipment.
コア部品製造プロセス
The communication power box enclosure comprises a main shell, mounting bracket, and side panels, all manufactured in compliance with ISO 9001 quality standards.
1.材料選択と、前処理
- Main structure: 0.8mm cold-rolled galvanized steel sheet, offering an excellent strength-to-weight ratio and corrosion resistance for miniaturized design.
- Pre-treatment: Fully automated ultrasonic degreasing, derusting, and phosphating to create a clean, high-adhesion surface base, ensuring optimal coating adhesion for the matte black finish.
2.コア製造プロセス
- 精密レーザー切断: 6000W fiber laser cutter with ±0.02mm tolerance, using nitrogen assist gas to minimize thermal distortion. This ensures clean, burr-free cuts for tiny interface cutouts, mounting holes, and wall-mounting slots.
- 数値制御ベンドマシン、形成する: 9-axis CNC bending machine with custom micro-jigs, controlling springback to ≤0.02mm to maintain consistent miniaturized dimensions and precise assembly gaps across all units.
- Interface & Mounting Machining: CNC punching and laser positioning technology are used to create precise power input/output cutouts, small signal holes, and wall-mounting bracket holes, with positional accuracy within ±0.01mm to guarantee seamless integration of internal power components.
- Matte Black Electrostatic Powder Coating:
- A uniform matte black coating is applied to all panels, offering excellent scratch resistance, anti-corrosion performance, and a professional aesthetic suitable for telecom environments.
- Coating thickness is strictly controlled at 40–80μm to ensure uniform coverage and long-term durability without compromising the ultra-compact profile.
- Assembly & Structural Reinforcement: The main shell and mounting bracket are joined with precision spot welding and screw fasteners, reinforced by internal snap-fit structures to maintain structural rigidity while keeping the enclosure lightweight.
3.品質管理と、テスト
- 寸法検査: CMM (Coordinate Measuring Machine) full-size inspection to verify tolerance compliance and interface alignment.
- Coating Quality Test: Cross-hatch adhesion testing and visual inspection to ensure uniform matte black color and finish across all units.
- Mounting Stability Test: Verification of wall-mounting bracket strength and secure installation.
- Interface Fit Test: Assembly testing with the client’s power modules to verify seamless fit and electrical safety.
- 100% Final Inspection: All units undergo full functional and appearance inspection before delivery to achieve zero defects.
プロジェクトの課題と、ソリューション
1. Challenge: Ultra-Compact Design with Structural Rigidity
The tiny 2.5cm profile required careful design to avoid deformation while maintaining sufficient strength to protect internal power components.
解決策: We optimized the internal structure with integrated snap-fit reinforcing ribs, increasing structural rigidity by 20% without adding weight or thickness, ensuring stable performance under installation stress.
2. Challenge: Precision Alignment of Miniature Interface Ports
The enclosure features multiple tiny interface cutouts that demand extreme precision to ensure seamless component fitting and electrical safety.
解決策: We combined laser cutting with CNC micro-punching, using real-time positioning calibration. Pre-production sample assembly with the client’s power modules was conducted to validate fit before mass production, eliminating assembly errors.
3. Challenge: Uniform Matte Black Finish Across Large Small-Batch Production
Achieving consistent matte black color and texture across 470 tiny units was critical to maintaining the product’s professional appearance.
解決策: We implemented a standardized coating process with automated powder application and strict temperature control. Sampling inspection per 30 units ensures color consistency and coating adhesion, with zero color difference reported in final delivery.
4. Challenge: Secure Wall-Mounting in Miniature Size
The compact design required a robust wall-mounting solution without compromising the enclosure’s slim profile.
解決策: We designed an integrated mounting bracket with dual-hole positioning, ensuring secure installation while maintaining the enclosure’s lightweight and compact form factor.
プロジェクトの成果
- 納品: 470 units completed and delivered 3 days ahead of the 25-day schedule, with a 100% pass rate in all quality tests.
- Performance: Enclosures demonstrated stable operation in telecom environments, with no structural deformation, component fitting issues, or coating wear reported during 6 months of field testing. The ultra-compact design enabled flexible installation in limited-space communication setups.
- Partnership: The client signed a 2-year strategic cooperation agreement, appointing Sanjun Hardware as the exclusive sheet metal enclosure supplier for its full line of compact communication power modules.
